Company Filing History:
Years Active: 2014-2015
Title: Chang Yi Lan: Innovator in Semiconductor Packaging
Introduction
Chang Yi Lan is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative approaches have enhanced the efficiency and reliability of semiconductor manufacturing processes.
Latest Patents
Chang Yi Lan's latest patents include a fabrication method of a semiconductor package. This method involves several steps, such as forming a packaging substrate on a first carrier, bonding a second carrier to the packaging substrate, and removing the first carrier. The process also includes disposing of a chip on the packaging substrate, forming an encapsulant to encapsulate the chip, and finally removing the second carrier. The use of the first and second carriers provides the thin-type packaging substrate with sufficient rigidity to undergo fabrication processes without cracking or warpage. This innovation meets the miniaturization requirements and improves product yield.
Another notable patent is the semiconductor package and fabrication method thereof, which shares similar steps and benefits. This method also emphasizes the importance of maintaining substrate integrity during the fabrication process, ensuring high-quality semiconductor packages.
Career Highlights
Chang Yi Lan is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company in semiconductor packaging has allowed him to develop and refine his innovative techniques. His contributions have been instrumental in advancing the company's capabilities in the semiconductor industry.
Collaborations
Chang has collaborated with notable coworkers, including Wei Chung Hsiao and Chun Hsien Lin. Their teamwork has fostered an environment of innovation and excellence in semiconductor packaging.
Conclusion
Chang Yi Lan's contributions to semiconductor packaging through his patents and work at Siliconware Precision Industries Co., Ltd. highlight his role as a key innovator in the field. His methods not only enhance product yield but also address the challenges of miniaturization in semiconductor technology.