Incheon, South Korea

Chang Man You

This inventor holds 1 USPTO granted patent. Top assignee: W.c. Heraeus Gmbh & Co Kg. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang Man You. Retrieved from https://idiyas.com/inventor/chang-man-you

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Chang Man You: Innovator in Bonding Wire Technology

Introduction

Chang Man You is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of bonding wire technology, particularly through his innovative designs and methods.

Latest Patents

Chang Man You holds a patent for a "Spool case for bonding wire, and method of handling spool using same." This invention addresses the challenges associated with the durability and handling of bonding wire spools. The spool case is designed to prevent deterioration during repeated coupling and decoupling operations. It also ensures that the bonding wire remains uncontaminated and undamaged, which is crucial for maintaining the quality of the wire. The design includes a base with a spool receipt portion and a cover that protects against foreign materials such as dust.

Career Highlights

Chang Man You is currently employed at W.C. Heraeus GmbH & Co. KG, where he continues to develop innovative solutions in the field of bonding wire technology. His work has been instrumental in enhancing the efficiency and reliability of bonding wire applications.

Collaborations

Chang Man You collaborates with his coworker, Jung Woo Back, to further advance their projects and innovations in bonding wire technology.

Conclusion

Chang Man You's contributions to bonding wire technology exemplify his commitment to innovation and quality. His patent reflects a deep understanding of the industry's needs and showcases his ability to create effective solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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