Seongnam, South Korea

Chang Ju Kim

This inventor holds 1 USPTO granted patent. Top assignee: Hyundai Kefico Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang Ju Kim. Retrieved from https://idiyas.com/inventor/chang-ju-kim-2d0958ta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chang Ju Kim and High-Voltage Connector Shielding

Introduction

Chang Ju Kim is an inventor based in Seongnam, South Korea, associated with Hyundai Kefico Corporation. His patent work includes a shielding module designed for a high-voltage connector used in a controller.

Latest Patents

The available information identifies one patent for Chang Ju Kim: “Shielding Module for High Voltage Connector.” The module connects to a high-voltage connector embedded in a controller housing. It includes a base plate, a shielding terminal that contacts the housing’s inner wall and the connector’s shielding plate, and a sealing holder that protrudes from the base plate. A membrane is formed in a slit in the holder; the slit and membrane may each have a long-hole shape. The described design brings together shielding and sealing features in a connector assembly.

Career Highlights

Kim’s listed patent activity comprises 1 patent. His association with Hyundai Kefico Corporation connects his invention to the development of automotive components and systems.

Collaborations

The available information associates Kim with Hyundai Kefico Corporation and identifies no additional collaborators.

Conclusion

Chang Ju Kim’s patent describes a shielding module that combines electrical shielding and a membrane-based sealing feature for a high-voltage connector, reflecting his documented contribution to connector technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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