Chang Hwa Tom Chung

Title: Chang Hwa Tom Chung: Innovator in Electronic Packaging

Introduction

Chang Hwa Tom Chung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on innovative solutions that enhance the functionality and efficiency of electronic devices.

Latest Patents

One of his latest patents is titled "Electronic package with stacked modules with channels passing through metal layers of the modules." This invention provides an electronic package comprising at least a first module and a second module arranged on top of the first module. The modules are adhesively connected, and each includes a substrate layer with at least one metal layer, at least one die, and a plastic package molding compound layer. The design features a plurality of channels that act as vias to connect the metal layers, ensuring electrical connectivity between the dice. Another significant patent is for a "Multi-chip package," which relates to packaging for multi-chip semiconductor devices, particularly useful in tire pressure monitoring systems.

Career Highlights

Chang Hwa Tom Chung is associated with the Hong Kong Applied Science and Technology Research Institute Company Limited. His work at this institution has allowed him to explore and develop advanced technologies in electronic packaging.

Collaborations

He has collaborated with notable coworkers such as Chi Kuen Vincent Leung and Peng Sun, contributing to various innovative projects in the field.

Conclusion

Chang Hwa Tom Chung's contributions to electronic packaging demonstrate his commitment to innovation and technology advancement. His patents reflect a deep understanding of the complexities involved in modern electronic devices.