Chang'an Wang

Title: Chang'an Wang: Innovator in 3D Stacked Packaging Technology

Introduction

Chang'an Wang is a prominent inventor based in Guangzhou, China. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to 3D stacked packaging structures. His work is instrumental in advancing the efficiency and functionality of electronic devices.

Latest Patents

Chang'an Wang holds a patent for a 3D stacked packaging structure and its manufacturing method. This invention includes a bottom-layer structure and a top-layer structure that are stacked together. Each structure consists of a substrate layer, a diamond layer grown on the substrate layer, an ion-implanted silicon wafer layer attached to the diamond layer, and a component layer provided on the silicon wafer layer. The design features at least one through hole that extends through the various layers and is filled with a conductive material, enhancing the overall performance of the packaging structure.

Career Highlights

Chang'an Wang is affiliated with the Institute of Semiconductors at the Guangdong Academy of Sciences. His role at this esteemed institution allows him to engage in cutting-edge research and development in semiconductor technologies. His innovative approach has led to advancements that benefit the electronics industry.

Collaborations

Chang'an Wang has collaborated with notable colleagues, including Yinhua Cui and Wei Zheng. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise in semiconductor research.

Conclusion

Chang'an Wang's contributions to 3D stacked packaging technology exemplify his commitment to innovation in the semiconductor field. His patent and collaborative efforts continue to influence advancements in electronic device manufacturing.