Company Filing History:
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Years Active: 2025
Title: Innovations of Chandra V Krishnaswamy
Introduction
Chandra V Krishnaswamy is an accomplished inventor based in Cedar Park, TX (US). He has made significant contributions to the field of electrical engineering, particularly in the area of testing cabled interconnects under mechanical stress. With a total of 2 patents, his work has advanced the understanding of signal integrity in connector-cable interfaces.
Latest Patents
Chandra's latest patents focus on systems and methods for testing cabled interconnects under mechanical stress. One of his methods includes transmitting first test signals to electrical pathways of a connector-cable interface between a cable and a test circuit board. This is done both in the absence of and in the presence of mechanical stress applied by a mechanical stressor. The method involves performing vector network analysis measurements for one or more electrical parameters based on resultant signals from the electrical pathways. By analyzing the differences between these measurements, it is possible to determine whether the connector-cable interface meets signal integrity requirements. Another patent similarly addresses the testing of cabled interconnects, emphasizing the importance of signal equalization parameters in the presence of mechanical stress.
Career Highlights
Chandra V Krishnaswamy is currently employed at Dell Products Inc., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the reliability and performance of electronic connections in various applications.
Collaborations
Chandra collaborates with William Andrew Smith, a talented coworker who contributes to their shared projects and innovations.
Conclusion
Chandra V Krishnaswamy's contributions to the field of electrical engineering through his patents and work at Dell Products Inc. highlight his role as a key innovator in testing cabled interconnects. His advancements in ensuring signal integrity under mechanical stress are vital for the future of electronic connectivity.