Chan-Yu Yeh

Title: Innovations of Chan-Yu Yeh in Electronic Packaging

Introduction

Chan-Yu Yeh is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative designs and structures. His work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

One of Chan-Yu Yeh's key patents is titled "Electronic package and substrate structure thereof." This invention provides a novel electronic package and substrate structure, where a circuit layer and a filling layer are formed on a substrate body. The circuit layer consists of multiple conductive traces that are separated from each other, allowing the filling layer to be filled between these traces. A portion of the surface of the circuit layer and the filling layer is covered with an insulating protective layer. This design ensures that the insulating protective layer is supported by the filling layer, enabling it to be thin and effectively preventing copper migration in subsequent processes. Chan-Yu Yeh holds 1 patent for this innovative technology.

Career Highlights

Chan-Yu Yeh is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His role involves developing advanced electronic packaging solutions that meet the demands of modern technology. His expertise in this area has positioned him as a valuable asset to his organization.

Collaborations

Chan-Yu Yeh has collaborated with several talented individuals in his field, including Yuan-Chang Ni and Yu-Cheng Pai. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chan-Yu Yeh's contributions to electronic packaging through his patent and work at Siliconware Precision Industries Co., Ltd. highlight his importance in the field. His innovative designs continue to influence the development of reliable electronic components.