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For the Inventor, By the Inventor

Kyungki-do, South Korea

Chan Wang Park

This inventor holds 6 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2003-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chan Wang Park. Retrieved from https://idiyas.com/inventor/chan-wang-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 136(Granted Patents)


Location History:

  • Seoul, KR (2003 - 2005)
  • Sungnam, KR (2004 - 2005)
  • Kyungki-do, KR (2003 - 2007)

Company Filing History:

goldMedal6 out of 7,633 
 
Samsung Electro-Mechanics Co., Ltd.
 patents

Years Active: 2003-2007

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6 patents (USPTO):Explore Patents
1. 7156538 - LED package for backlight unit (2007-01-02),
2. D512693 - Light-emitting diode (2005-12-13),
3. 6928719 - Method for fabricating surface acoustic wave filter package (2005-08-16),
4. 6730539 - Method of manufacturing semiconductor device package (2004-05-04),
5. 6670206 - Method for fabricating surface acoustic wave filter packages (2003-12-30),
6. 6653725 - Chip package and method of manufacturing the same (2003-11-25),

Title: The Innovations of Chan Wang Park

Introduction

Chan Wang Park is a prominent inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of technology, particularly in the development of LED packages. With a total of 6 patents to his name, Park continues to push the boundaries of innovation.

Latest Patents

One of his latest patents is an LED package designed for backlight units. This innovative package includes a plurality of LEDs, a die bonding part, a wire bonding part, and a body. The die bonding part allows the first electrodes of the LEDs to connect electrically to an external circuit. The wire bonding part is insulated from the die bonding part and enables the second electrodes of the LEDs to connect to the external circuit, ensuring the LEDs operate effectively. The body features a molding cup that fills the space above the LEDs with transparent resin, along with a base that supports both the die bonding and wire bonding parts.

Career Highlights

Chan Wang Park is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing LED technology, which is widely used in various applications today.

Collaborations

Throughout his career, Park has collaborated with notable colleagues, including Tae Hoon Kim and Joo Hun Park. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Chan Wang Park's contributions to the field of LED technology exemplify his dedication to innovation. His patents and collaborations highlight his role as a leading inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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