Bedford, MA, United States of America

Champak Das

This inventor holds 1 USPTO granted patent. Top assignee: Airvana, Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Champak Das. Retrieved from https://idiyas.com/inventor/champak-das-8umibtjh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 49(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of Champak Das

Introduction

Champak Das is an accomplished inventor based in Bedford, MA (US). He has made significant contributions to the field of telecommunications, particularly in radio access networks. His innovative ideas have led to the development of a unique patent that enhances the efficiency of paging areas.

Latest Patents

Champak Das holds a patent for "Non-circular paging areas." This invention focuses on techniques for defining a non-circular paging area in which an access terminal is to be paged based on distance-based location updating information for a sector of the network. This patent showcases his ability to address complex challenges in network design and functionality. He has 1 patent to his name.

Career Highlights

Champak Das is currently employed at Airvana, Inc., where he continues to push the boundaries of innovation in telecommunications. His work at Airvana has allowed him to collaborate with other talented professionals in the industry, further enhancing his expertise and contributions.

Collaborations

Some of his notable coworkers include Vivek Sharma and Prasasth Reddy Palnati. Their collaborative efforts have contributed to the advancement of technology in their field.

Conclusion

Champak Das is a notable inventor whose work in non-circular paging areas has made a significant impact on radio access networks. His contributions continue to shape the future of telecommunications technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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