logo

For the Inventor, By the Inventor

Malacca, Malaysia

Chai Chee Lee

This inventor holds 3 USPTO granted patents and 5 published patent applications. Top assignee: Infineon Technologies Ag. Active years: 2021-2026.

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 2.7

ph-index = 1


Company Filing History:

goldMedal3 out of 15,013 
 
Infineon Technologies Ag
 patents

Years Active: 2021-2026

Loading Chart...
3 patents (USPTO):Explore Patents
1. 12702048 - Encapsulated package with exposed electrically conductive structures and sidewall recess (2026-08-04),
2. 12538810 - Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die (2026-01-27),
3. 11183451 - Interconnect clip with angled contact surface and raised bridge (2021-11-23),
This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to [email protected]
Loading…