Company Filing History:
Years Active: 2008-2015
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Title: Innovator Spotlight: Chad Daniel Attlesey
Introduction
Chad Daniel Attlesey, a prolific inventor based in Rochester, MN, has made significant contributions to the field of electronic cooling systems with an impressive portfolio of 18 patents. His groundbreaking work has revolutionized the way electronic devices are cooled, particularly in server computers and data storage systems.
Latest Patents
Attlesey's latest patents include the innovative Rack Mounted Liquid Submersion Cooled Electronic System. This system utilizes a liquid submersion cooling technique to efficiently cool heat-generating components in server computers and other electronic devices connected in parallel systems. It features a housing with an interior space filled with dielectric cooling liquid, providing optimal thermal management. Additionally, his Liquid Submersion Cooled Data Storage or Memory System showcases his commitment to effective cooling solutions for electronic devices.
Career Highlights
Having worked with esteemed companies such as Hardcore Computer, Inc. and Liquidcool Solutions, Inc., Attlesey has honed his skills and expertise in the realm of electronic cooling technologies. His dedication to innovation and commitment to improving thermal performance in electronic systems have earned him recognition within the industry.
Collaborations
Throughout his career, Attlesey has collaborated with notable professionals such as R. Daren Klum and Allen James Berning. These collaborations have not only enriched his projects but have also facilitated the exchange of ideas and expertise in the field of electronic cooling systems.
Conclusion
In conclusion, Chad Daniel Attlesey's innovative approach to electronic cooling systems has solidified his reputation as a trailblazer in the industry. His patents and collaborations underscore his commitment to advancing technological solutions for efficient thermal management in electronic devices. Attlesey's contributions continue to shape the landscape of electronic cooling systems, paving the way for future innovations in the field.
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