Taiyuan, China

Ce Ji

This inventor holds 1 USPTO granted patent. Top assignee: Taiyuan University of Technology. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ce Ji. Retrieved from https://idiyas.com/inventor/ce-ji-77km6dfa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Biography of Inventor Ce Ji

Introduction

Ce Ji is a prominent inventor based in Taiyuan, China. He has made significant contributions to the field of metal cladding technology, particularly through his innovative patent.

Latest Patents

Ce Ji holds a patent for a "Continuous rolling device and method with interfacial temperature-force controllability for seamless metal cladding pipe." This invention discloses a continuous rolling device that includes a multi-roller skew rolling mill set, an interfacial temperature-force controlled rolling mill set, and a sizing and finishing mill set. The device is designed to enhance the efficiency and quality of seamless metal cladding pipes.

Career Highlights

Ce Ji is affiliated with Taiyuan University of Technology, where he continues to advance his research and development efforts. His work focuses on improving manufacturing processes in the metal industry.

Collaborations

Throughout his career, Ce Ji has collaborated with notable colleagues, including Tao Wang and Xingcheng Wang. These partnerships have contributed to the advancement of their shared research interests.

Conclusion

Ce Ji's innovative contributions to the field of metal cladding technology exemplify his dedication to advancing industrial processes. His patent reflects a significant step forward in the manufacturing of seamless metal cladding pipes, showcasing his expertise and commitment to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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