Carol Radens

Title: Carol Radens: Innovator in Interconnect Structures

Introduction

Carol Radens is a notable inventor based in Lagrangeville, NY (US). She has made significant contributions to the field of interconnect structures, showcasing her expertise and innovative spirit. With a focus on enhancing technology, her work has implications for various applications in the electronics industry.

Latest Patents

Carol Radens holds a patent for "Interconnect structures with encasing cap and methods of making thereof." This patent describes a method of creating an interconnect that involves providing an interconnect structure within a dielectric material. The process includes recessing the dielectric material so that a portion of the interconnect structure extends above the upper surface of the dielectric. Additionally, an encasing cap is deposited over the extended portion of the interconnect structure. This innovation reflects her commitment to advancing technology in her field.

Career Highlights

Carol is currently employed at International Business Machines Corporation, commonly known as IBM. Her role at IBM allows her to collaborate with some of the brightest minds in the industry, contributing to groundbreaking projects and research.

Collaborations

Throughout her career, Carol has worked alongside talented colleagues, including Kwong Hon Wong and Louis C Hsu. These collaborations have fostered an environment of innovation and creativity, leading to advancements in technology.

Conclusion

Carol Radens is a pioneering inventor whose work in interconnect structures has made a significant impact in the field of electronics. Her dedication to innovation and collaboration continues to inspire others in the industry.