Wappingers Falls, NY, United States of America

Carla Natalia Cordero


Average Co-Inventor Count = 11.3

ph-index = 4

Forward Citations = 21(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (1996 - 1998)
  • Colchester, VT (US) (1999)
  • Essex Junction, VT (US) (1999 - 2001)

Company Filing History:


Years Active: 1996-2001

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8 patents (USPTO):Explore Patents

Title: The Innovative Journey of Carla Natalia Cordero

Introduction

Carla Natalia Cordero is a prominent inventor based in Wappingers Falls, NY (US). She has made significant contributions to the field of materials science, particularly in the area of aluminum nitride. With a total of eight patents to her name, Cordero's work has had a substantial impact on electronic packaging.

Latest Patents

Among her latest patents is a method for controlling certain second phases in aluminum nitride. This innovation addresses the issue of ceramic defects that can occur in electronic packages with a high area percent coverage of blanket metal. Cordero's research indicates that these defects may be linked to the decomposition of the liquid sintering aid. In her experiments, unique additions to the metallization have successfully prevented the formation of these ceramic defects. Her approach involves a unique composition used in an existing process, showcasing her innovative thinking.

Career Highlights

Throughout her career, Cordero has worked with notable companies, including International Business Machines Corporation (IBM) and The Carborundum Company. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking advancements in her field.

Collaborations

Cordero has collaborated with esteemed colleagues such as Benjamin V. Fasano and David B. Goland. These partnerships have further enriched her research and development efforts.

Conclusion

Carla Natalia Cordero's contributions to the field of materials science and her innovative patents highlight her as a leading figure in her industry. Her work continues to influence advancements in electronic packaging and materials engineering.

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