Carl L Chapman

Title: Innovations by Carl L Chapman

Introduction

Carl L Chapman is an accomplished inventor based in Monroe, CT (US). He has made significant contributions to the field of mailpiece fabrication systems, holding a total of 2 patents. His innovative designs have improved the efficiency and effectiveness of envelope sealing and content delivery systems.

Latest Patents

One of Chapman's latest patents is for an "Inter-machine buffer for mailpiece fabrication system." This invention includes a system and method for wrapping sheet material to produce finished mailpieces. It features an upstream content module, a downstream mailpiece assembly module, and a buffer module that maintains a threshold pitch distance between successive pieces of content material. The controller coordinates the delivery and insertion of content material into the wrapper module, optimizing system throughput and minimizing dry-holes.

Another notable patent is the "Apparatus and method for sealing an envelope." This invention describes a process where an envelope with its flap in an open position is driven along a transport path. As the crease line between the flap and the body of the envelope reaches a predetermined location, buckling means engage the envelope to cause it to buckle laterally and be partially closed. The envelope is then fully closed by sealing means, enhancing the efficiency of the sealing process.

Career Highlights

Carl L Chapman has had a successful career at Pitney Bowes Inc., where he has applied his inventive skills to develop advanced mailing solutions. His work has contributed to the company's reputation as a leader in mailing technology.

Collaborations

Throughout his career, Chapman has collaborated with notable colleagues, including Robert J Allen and David K Halden. These partnerships have fostered innovation and the development of cutting-edge technologies in the mailing industry.

Conclusion

Carl L Chapman is a prominent inventor whose work has significantly impacted the mailing industry. His patents demonstrate a commitment to innovation and efficiency in mailpiece fabrication systems.