Calla K Stoick is a prominent inventor based in Des Plaines, IL (US). She has made significant contributions to the field of adhesive technology, particularly in the development of innovative wafer designs. With a total of 2 patents to her name, Stoick's work has garnered attention for its practical applications in various industries.

Latest Patents

Stoick's latest patents include a method of making a wafer having an adhesive skin barrier layer. This invention discloses an adhesive wafer that features a thin barrier layer made of soft, pliant adhesive material, with particles of one or more hydrocolloids dispersed throughout. A flexible and preferably stretchable cover layer extends along one side of the barrier layer, while a removable release sheet protects the opposite side. The wafer is designed with a central zone and a relatively large outer zone surrounding it. The material in the outer zone exhibits generally uniform molecular orientations in radial directions over an arc of 360 degrees, ensuring relatively uniform tensile strength in all such radial directions. Additionally, Stoick has developed injection/compression molding methods for producing these wafers.

Career Highlights

Stoick is currently employed at Hollister, Inc., where she continues to innovate and refine adhesive technologies. Her work has been instrumental in advancing the capabilities of adhesive wafers, making them more effective and versatile for various applications.

Collaborations

Throughout her career, Stoick has collaborated with notable colleagues, including Ronald S Botten and Larry R DeCamp. These partnerships have contributed to the successful development and implementation of her patented technologies.

Conclusion

Calla K Stoick is a trailblazer in the field of adhesive wafer technology, with her innovative patents paving the way for advancements in the industry. Her contributions continue to impact the development of effective adhesive solutions.