Los Angeles, CA, United States of America

C Thomas Vangsness, Jr

This inventor holds 1 USPTO granted patent. Top assignee: University of Southern California. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: C Thomas Vangsness, Jr. Retrieved from https://idiyas.com/inventor/c-thomas-vangsness-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: C. Thomas Vangsness, Jr.: An Inventor in Cartilage Regeneration.

Introduction

C. Thomas Vangsness, Jr. is an inventor based in Los Angeles, California. His patent work includes a polymeric scaffold designed to support the treatment of articular cartilage defects.

Latest Patents

Vangsness is associated with 1 patent, titled “Polymeric Patch Scaffolds for Articular Cartilage Regeneration.” The invention describes a biocompatible polymeric sheet shaped and sized to cover a chondral or osteochondral defect. Openings in the sheet allow it to be secured with sutures. The patent also describes a method for treating a subject with such a defect.

Career Highlights

Vangsness is associated with the University of Southern California. His patent reflects an application of polymeric materials to scaffold design for cartilage repair.

Collaborations

His listed coworkers include Mark S. Humayun and Carlos Eduardo Da Silveira Franciozi. Their shared institutional association connects their work to the University of Southern California.

Conclusion

C. Thomas Vangsness, Jr.’s patent focuses on a suturable, biocompatible polymeric scaffold intended to support treatment of cartilage defects.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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