C C Yang

Title: C C Yang - Innovator in Chemical-Mechanical Polishing Technology

Introduction

C C Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing (CMP) technology. His innovative designs have improved the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

C C Yang holds a patent for a "Retainer ring for polishing head of chemical-mechanical polish machines." This invention provides a retainer ring designed for use on the polishing head of a CMP machine. The retainer ring allows the slurry applied during the CMP process to be uniformly distributed over the surface of the wafer. The design includes a plurality of straight grooves that are radially inclined, forming an acute angle of attack against the slurry when the retainer ring spins. This unique feature enables the slurry to be drawn into the retainer ring from all radial directions, ensuring even distribution over the wafer.

Career Highlights

C C Yang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work focuses on enhancing CMP processes, which are critical for the production of high-quality semiconductor devices. His innovative approach has led to advancements that benefit the manufacturing sector.

Collaborations

C C Yang has collaborated with notable colleagues, including Daniel Chiu and Peng-Yih Peng. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor field.

Conclusion

C C Yang's contributions to CMP technology exemplify the importance of innovation in the semiconductor industry. His patent for the retainer ring showcases his commitment to improving manufacturing processes. Through his work at United Microelectronics Corporation, he continues to influence the future of semiconductor technology.