Company Filing History:
Years Active: 1993
Title: Byung W Lee - Innovator in Semiconductor Sealing Technology
Introduction
Byung W Lee is a notable inventor based in Yongin, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of epoxy resin compositions.
Latest Patents
Byung W Lee holds a patent for an "Imide epoxy resin composition for sealing semiconductor elements." This innovative epoxy resin composition includes o-cresol-novolak type epoxy resins, curing agents, curing accelerators, plasticizers, and a high-performance epoxy resin. The use of this high-performance epoxy resin, in an amount ranging from 0.1 to 20.0% by weight, enhances the heat and moisture resistance of the epoxy resin composition.
Career Highlights
Lee is associated with Cheil Industries Inc., where he has been instrumental in advancing semiconductor sealing technologies. His work has been pivotal in improving the reliability and performance of semiconductor elements.
Collaborations
Some of his notable coworkers include Whan G Kim and Ji Young Lee, who have collaborated with him on various projects within the semiconductor field.
Conclusion
Byung W Lee's contributions to epoxy resin technology for semiconductor sealing demonstrate his innovative spirit and commitment to enhancing electronic materials. His work continues to influence the industry positively.