The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 1993

Filed:

Oct. 21, 1992
Applicant:
Inventors:

Whan G Kim, Seoul, KR;

Byung W Lee, Yongin, KR;

Ji Y Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08G / ; C08G / ;
U.S. Cl.
CPC ...
523428 ; 523429 ; 523443 ; 523466 ; 525476 ; 525482 ; 525484 ; 528 96 ;
Abstract

An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, plasticizer and a high performance epoxy resin selected from a group consisting of epoxy resins represented by the formulas (I-a), (I-b) and (I-c) is disclosed. Use of the high performance epoxy resin in an amount of from 0.1 to 20.0% by weight improves the heat and moisture resistance of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 represent independently H or (CH.sub.2) nCH.sub.3 radical, and


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