Seongnam, South Korea

Byung-seung Kim

This inventor holds 3 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung-seung Kim. Retrieved from https://idiyas.com/inventor/byung-seung-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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3 patents (USPTO):Explore Patents

Title: Byung-seung Kim: Innovator in Multi-Connectivity Technologies

Introduction

Byung-seung Kim is a prominent inventor based in Seongnam, South Korea. He has made significant contributions to the field of telecommunications, particularly in multi-connectivity technologies. With a total of 3 patents to his name, Kim continues to push the boundaries of innovation in his industry.

Latest Patents

One of Kim's latest patents is a method and apparatus for splitting data in multi-connectivity. This innovative method involves estimating the round trip time (RTT) taken in transmitting data to multiple base stations. By determining the size of the data to be transmitted based on these estimations, the technology enhances the efficiency of data transmission between user equipment and base stations.

Career Highlights

Kim is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to develop cutting-edge solutions that address the challenges of modern telecommunications. His expertise in multi-connectivity has positioned him as a key player in the advancement of network technologies.

Collaborations

Throughout his career, Kim has collaborated with talented individuals such as Hee-su Im and Eun-jun Choi. These collaborations have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Byung-seung Kim's contributions to the field of telecommunications exemplify the spirit of innovation. His work in multi-connectivity technologies continues to shape the future of data transmission.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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