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For the Inventor, By the Inventor

Gyeonggi-do, South Korea

Byung Sam Choi

This inventor holds 10 USPTO granted patents and 9 published patent applications. Top assignee: Hyundai Motor Company. Active years: 2013-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung Sam Choi. Retrieved from https://idiyas.com/inventor/byung-sam-choi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 90.0

Average Co-Inventor Count = 4.2

ph-index = 4

Forward Citations = 31(Granted Patents)


Location History:

  • Gunpo, KR (2015)
  • Gyeonggi-do, KR (2013 - 2019)

Company Filing History:

goldMedal10 out of 20,267 
 
Hyundai Motor Company
 patents

Years Active: 2013-2019

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10 patents (USPTO):Explore Patents
1. 10375858 - Electronic/electrical component housing with strips of metal plate and shape memory material forming a heat transfer path (2019-08-06),
2. 9603288 - Electronic/electrical component housing with strips of metal plate and shape memory material forming a heat transfer path (2017-03-21),
3. 9401500 - Battery package filled with phase change material and battery using the same (2016-07-26),
4. 9296871 - High heat radiation composite and a method of fabricating the same (2016-03-29),
5. 9065160 - Radiant heat plate for battery cell module and battery cell module having the same (2015-06-23),
6. 9017570 - Hybrid filler for electromagnetic shielding composite material and method of manufacturing the hybrid filler (2015-04-28),
7. 8926300 - Micro particle for thermal control material and device and method of producing the same using ultrasonic high-temperature vibration scheme (2015-01-06),
8. 8829063 - High heat radiation composite and a method of fabricating the same (2014-09-09),
9. 8518574 - Heat control pouch for battery cell module and battery cell module having the same (2013-08-27),
10. 8465864 - Heat dissipation plate for battery cell module and battery cell module having the same (2013-06-18),

Title: Byung Sam Choi: Innovator in Electronic Component Housing

Introduction

Byung Sam Choi is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of electronic and electrical components, holding a total of 10 patents. His innovative designs focus on enhancing the efficiency and functionality of electronic devices.

Latest Patents

One of his latest patents involves an electronic/electrical component housing that incorporates strips of metal plate and shape memory material to form a heat transfer path. This housing consists of an inner panel and an outer panel, which are arranged parallel to each other to create an internal space. The strip of metal plate extends from the inner surface of the outer panel, while the strip of shape memory material extends from the inner surface of the inner panel. This design allows the shape memory material to attach or detach from the metal plate based on temperature variations. When the temperature exceeds a first transition temperature, the shape memory material straightens, creating a heat transfer path. Conversely, in low-temperature environments, the material bends and separates from the metal plate, interrupting the heat transfer path.

Career Highlights

Byung Sam Choi is currently employed at Hyundai Motor Company, where he continues to innovate and develop new technologies. His work has significantly impacted the automotive industry, particularly in the realm of electronic components.

Collaborations

He collaborates with talented coworkers, including Jin Woo Kwak and Kyong Hwa Song, who contribute to his projects and enhance the overall innovation process.

Conclusion

Byung Sam Choi's contributions to electronic component housing demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of material properties and their applications in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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