Suwon-si, South Korea

Byung Jik Kim

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung Jik Kim. Retrieved from https://idiyas.com/inventor/byung-jik-kim-4sagfl4a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Byung Jik Kim and Integrated Circuit Link Equalization

Introduction

Byung Jik Kim is an inventor based in Suwon-si, South Korea. His patent work includes an integrated-circuit method for link equalization, a process used to improve signal transmission between connected circuits.

Latest Patents

Kim is associated with 1 patent: “Integrated Circuit for Performing Link Equalization.” The invention describes completing an initial link-equalization operation between integrated circuits, measuring the eye margin of a received signal, and comparing the measurement with a threshold. The circuit stores the comparison result and sends it to the external circuit, where the result guides a subsequent link-equalization operation.

Career Highlights

Kim’s listed patent is associated with Samsung Electronics Ltd. It focuses on signal measurement and feedback between internal and external transmitters and receivers, supporting a second equalization operation based on the measured signal quality.

Collaborations

Kyu-min Park and Seung-woo Lim are identified as Kim’s coworkers. The available information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Byung Jik Kim’s patent work at Samsung Electronics Ltd. addresses link equalization through signal measurement and feedback, with the aim of improving communication between integrated circuits.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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