Ottawa, Canada

Byron Blackmore

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Industry Software Nv. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byron Blackmore. Retrieved from https://idiyas.com/inventor/byron-blackmore-s6j7mxli

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Byron Blackmore: Inventor in Thermal Modelling

Introduction

Byron Blackmore is an inventor based in Ottawa, Canada, associated with Siemens Industry Software NV. His patent work addresses computational modelling of thermal environments for electronic devices.

Latest Patents

Blackmore is credited with 1 patent: “Methods for Modelling and Manufacturing a Device.” The invention describes a method for modelling the thermal environment of an electronic device. It uses a volumetric mesh representing the device and its surrounding medium, assigns thermal parameters to mesh cells, and evaluates a computational model to determine temperatures throughout the region. The model embeds a boundary-condition-independent reduced-order model of at least one device component within a model of the surrounding medium.

Career Highlights

Blackmore’s patent reflects work on combining reduced-order component models with broader simulations of surrounding environments. This approach is intended to support thermal analysis of electronic devices.

Collaborations

The supplied information identifies Jin Liu and Mahmood Alkhenaizi as Blackmore’s coworkers. It does not specify their roles in the patent.

Conclusion

Byron Blackmore’s recorded invention focuses on computational methods for modelling heat around electronic devices, connecting detailed component models with simulations of their surrounding medium.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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