Byong-Shik Lee

Title: Byong-Shik Lee: Innovator in Laser Processing Technology

Introduction

Byong-Shik Lee is a notable inventor based in Gunpo-si, South Korea. He has made significant contributions to the field of laser processing technology, particularly through his innovative methods and apparatuses designed for material processing.

Latest Patents

Byong-Shik Lee holds a patent for a "Laser processing method and laser processing apparatus." This patent focuses on the use of laser technology for processing materials, specifically detailing a method that involves loading a wafer onto a work stage. The process includes determining the number of chips formed on the wafer, performing chip defect inspections, and aligning the wafer while moving the work stage. Additionally, it describes measuring the height of the wafer's surface using a displacement sensor and monitoring the output power of the processing laser with a power meter. The method culminates in shifting the work stage while irradiating a laser beam on the wafer to achieve the desired processing.

Career Highlights

Throughout his career, Byong-Shik Lee has worked with various companies, including QMC Co., Ltd. His expertise in laser processing has positioned him as a key figure in advancing technology in this area.

Collaborations

Byong-Shik Lee has collaborated with notable professionals in his field, including Beng So Ryu and Hong-Jin Jung. These collaborations have contributed to the development and refinement of his innovative laser processing techniques.

Conclusion

Byong-Shik Lee's contributions to laser processing technology exemplify his commitment to innovation and excellence. His patent and career achievements highlight the importance of advancements in material processing methods.