The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Oct. 28, 2010
Beng SO Ryu, Incheon, KR;
Hong-jin Jung, Gunpo-si, KR;
Byong-shik Lee, Gunpo-si, KR;
Bum-joong Kim, Anyang-si, KR;
Hyeon-sam Jang, Anyang-si, KR;
Hark-yong Kim, Anyang-si, KR;
Jong-ho Kwak, Seoul, KR;
Young-yong Kim, Namyangju, KR;
Sun-young Hong, Seoul, KR;
Beng So Ryu, Incheon, KR;
Hong-Jin Jung, Gunpo-si, KR;
Byong-Shik Lee, Gunpo-si, KR;
Bum-Joong Kim, Anyang-si, KR;
Hyeon-Sam Jang, Anyang-si, KR;
Hark-Yong Kim, Anyang-si, KR;
Jong-Ho Kwak, Seoul, KR;
Young-Yong Kim, Namyangju, KR;
Sun-Young Hong, Seoul, KR;
QMC Co., Ltd., Gyeonggi-do, KR;
Other;
Abstract
The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.