Company Filing History:
Years Active: 2017
Title: Innovations by Byeongkap Choi
Introduction
Byeongkap Choi is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on bonding methods that enhance the efficiency and reliability of semiconductor devices.
Latest Patents
Byeongkap Choi holds a patent for a bonding method, bonding apparatus, and method for manufacturing substrate. This innovative bonding method involves aligning an electrical contact of a semiconductor chip with an electrical connection member of an underlying structure. The process includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material that encases the deformed electrical contact. The method further includes a second heating step to bond the electrical contact to the electrical connection member while maintaining the support material in a cured state. This patent showcases his expertise in semiconductor manufacturing processes.
Career Highlights
Choi is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung allows him to work on cutting-edge technologies and contribute to advancements in the semiconductor industry. His innovative approach has positioned him as a valuable asset to his team.
Collaborations
Choi has collaborated with talented coworkers such as Ilyoung Han and Kyoungran Kim. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in the semiconductor field.
Conclusion
Byeongkap Choi's contributions to semiconductor technology through his innovative bonding methods highlight his expertise and commitment to advancing the industry. His work at Samsung Electronics Co., Ltd. and his collaborations with fellow inventors further emphasize his role in shaping the future of technology.