The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Apr. 25, 2014
Ilyoung Han, Uiwang-si, KR;
Kyoungran Kim, Suwon-si, KR;
Donggil Shim, Bucheon-si, KR;
Youngjoo Lee, Seoul, KR;
Byunggon Kim, Seoul, KR;
Byeongkap Choi, Seoul, KR;
Ilyoung Han, Uiwang-si, KR;
Kyoungran Kim, Suwon-si, KR;
Donggil Shim, Bucheon-si, KR;
Youngjoo Lee, Seoul, KR;
Byunggon Kim, Seoul, KR;
Byeongkap Choi, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A bonding method for bonding a semiconductor chip to an underlying structure includes aligning an electrical contact of a lower surface of the semiconductor chip with an electrical connection member of an upper surface of the underlying structure, the electrical contact at least partially encased by a support material. The method further includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material encasing the deformed electrical contact. The method still further includes second heating the semiconductor chip and the underlying structure to bond the electrical contact of the semiconductor chip to the electrical connection member of the underlying structure while maintaining the support material in a cured state.