Suwon-si, South Korea

Byeongjin Kim

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byeongjin Kim. Retrieved from https://idiyas.com/inventor/byeongjin-kim-r44l4ore

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Byeongjin Kim and Precision Mounting Technology.

Introduction

Byeongjin Kim is an inventor based in Suwon-si, South Korea, and is associated with Samsung Electronics Ltd. His work includes a patent for a mounting device and method designed to achieve high-precision bonding.

Latest Patents

Kim is named on one patent, 1 patent: “Mounting Device and Mounting Method.” The invention describes a bonding actuator with a slider held inside a housing without contact, along with coils and yokes arranged to support controlled movement. Voice coil motors drive the slider along the X, Y, and Z axes and enable rotational adjustments in Tx, Ty, and Tz. This six-axis control allows the actuator to adjust the relative position and parallelism of a chip and wafer during bonding.

Career Highlights

Kim’s patent focuses on precision mounting, where accurate alignment and parallelism are important to the bonding process. The disclosed actuator design uses non-contact components and coordinated motor control to make fine positional adjustments.

Collaborations

The patent lists Masato Kajinami and Hansung Cho among Kim’s coworkers. Their inclusion reflects a shared professional context, though the available information does not specify their individual contributions to the invention.

Conclusion

Byeongjin Kim’s patent presents a six-axis actuator approach to high-precision chip-to-wafer bonding, highlighting his work in mounting technology at Samsung Electronics Ltd.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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