Location History:
- Gyeonggi-do, KR (2008)
- Yongin-si, KR (2020)
Company Filing History:
Years Active: 2008-2020
Title: Byeong-Yeon Cho: Innovator in Semiconductor Packaging
Introduction
Byeong-Yeon Cho is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Cho's latest patents include a method for manufacturing a stack package and a semiconductor package with a conductive molding compound. The stack package patent describes a process where a first semiconductor chip is formed on a first package substrate, and a second semiconductor chip is formed on a second package substrate. The invention involves stacking these components with an interposer substrate that features signal pads and a thermal diffusion member, optimizing heat dissipation and performance. The second patent addresses the use of a conductive molding compound in semiconductor packages, which prevents static charge accumulation and enhances heat conductivity. This innovation also improves electromagnetic compatibility, making it particularly valuable for high-speed signal processing.
Career Highlights
Byeong-Yeon Cho is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.
Collaborations
Cho has collaborated with notable colleagues, including Jae-Choon Kim and Eon-Soo Jang, to further enhance the development of innovative semiconductor solutions.
Conclusion
Byeong-Yeon Cho's contributions to semiconductor packaging through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His inventions not only improve device performance but also pave the way for future advancements in semiconductor technology.