Samsung Electronics Co., Ltd.

Byeong-Yeon Cho

Hee-Seok Lee

Jae-Choon Kim

Kyung-Lae Jang

Eon-Soo Jang

Eun-Hee Jung

Hyon-Chol Kim

In a method of manufacturing a stack package, a first semiconductor chip is formed on a first package substrate. A second semiconductor chip is formed on a second package substrate. A plurality of signal pads and a thermal diffusion member are formed on a lower surface and/or an upper surface of an interposer substrate, the signal pad having a first height and the thermal diffusion member having a second height greater than the first height. The first package substrate, the interposer substrate, and the second package substrate are sequentially stacked on one another such that the thermal diffusion member is in contact with an upper surface of the first semiconductor chip or a lower surface of the second package substrate.

Stack package and method of manufacturing the stack package

The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effectively dissipated externally. Additionally, the conductive compound blocks electromagnetic waves making possible an optimal semiconductor package satisfying the electromagnetic compatibility (EMC) and increasing the reliability of the semiconductor chip especially when processing high-speed signals.

Semiconductor package with conductive molding compound and manufacturing method thereof

Growing community of inventors

Yongin-si, South Korea

Byeong-Yeon Cho