Chilgok, South Korea

Byeong Chan Song

This inventor holds 1 USPTO granted patent. Top assignees: Hyundai Mobis Corporation, Sonid Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byeong Chan Song. Retrieved from https://idiyas.com/inventor/byeong-chan-song

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Byeong Chan Song: Inventor of a Photocurable Adhesive for Electrical Components.

Introduction

Byeong Chan Song is an inventor associated with Chilgok, South Korea. His listed patent concerns a photocurable pressure-sensitive adhesive composition designed for electrical components with three-dimensional structures.

Latest Patents

Song is credited with 1 patent: “Photocurable Pressure-Sensitive Adhesive Composition for Electrical Components with Three-Dimensional Structure.” The invention describes a functional adhesive composition intended to provide heat resistance and bending resistance. Its specified ingredients include urethane acrylate oligomer, acrylate monomer, photoinitiator, silane coupling agent, light stabilizer, ultraviolet absorber, and antioxidant. The patent also addresses electrical components with a three-dimensional structure that use the composition.

Career Highlights

Song’s listed company affiliations include Hyundai Mobis Corporation and Sonid Inc. His patent work focuses on adhesive materials for electrical components.

Collaborations

Song’s listed coworker is Hyeon Don Kim, who is associated with his patent-related work.

Conclusion

Byeong Chan Song’s recorded invention combines a photocurable adhesive formulation with the practical demands of heat resistance and bending resistance in three-dimensional electrical components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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