This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Buwon Kim: Innovator in Semiconductor Packaging
Introduction
Buwon Kim is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized within the technology sector, where advancements in semiconductor technology are crucial.
Latest Patents
Buwon Kim holds a patent for a semiconductor package. This invention includes a package substrate with a first surface and a second surface that is opposite to the first. The design features first substrate pads arranged in a first row and second substrate pads in a second row on the first surface. The semiconductor package also incorporates a first semiconductor chip with first chip pads, lower bonding wires that couple the first chip pads to the first substrate pads, and a second semiconductor chip with second chip pads. Upper bonding wires connect the second chip pads to the second substrate pads. An encapsulant covers both semiconductor chips, ensuring their protection and functionality. This innovative design enhances the efficiency and reliability of semiconductor packages.
Career Highlights
Buwon Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves working on cutting-edge technologies that drive advancements in semiconductor solutions. His contributions have been instrumental in developing products that meet the growing demands of the market.
Collaborations
Buwon Kim collaborates with his coworker, Sangsub Song, to further enhance their projects and innovations. Their teamwork exemplifies the collaborative spirit that is essential in the fast-paced technology sector.
Conclusion
Buwon Kim's work in semiconductor packaging reflects his dedication to innovation and excellence. His patent and contributions to Samsung Electronics Co., Ltd. highlight the importance of advancements in technology. Through his efforts, he continues to shape the future of semiconductor solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile