Houston, TX, United States of America

Burleigh R Murphree

This inventor holds 1 USPTO granted patent. Top assignee: Peabody Dore' Corporation. Active years: 1976.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Burleigh R Murphree. Retrieved from https://idiyas.com/inventor/burleigh-r-murphree

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 1976

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1 patent (USPTO):Explore Patents

Title: Burleigh R. Murphree: Innovator in Expansion Joint Technology

Introduction

Burleigh R. Murphree is a notable inventor based in Houston, TX (US). He has made significant contributions to the field of engineering, particularly with his innovative designs that enhance safety and efficiency in various applications.

Latest Patents

Murphree holds a patent for an expansion joint, which features a first corrugated tubular member with a series of ridges and valleys. This design includes connections at each end for integration into a conduit. A second corrugated tubular member encircles the first, designed to catch any material that may leak from the first member, thereby preventing environmental contamination. The second member is flexible, allowing it to move with the first, and is preferably transparent, enabling visual inspection of any leaks.

Career Highlights

Throughout his career, Burleigh R. Murphree has been associated with Peabody Dore' Corporation, where he has applied his expertise in developing innovative solutions for industrial applications. His work has been instrumental in advancing the technology of expansion joints, making them safer and more reliable.

Conclusion

Burleigh R. Murphree's contributions to the field of engineering through his patented expansion joint technology exemplify his commitment to innovation and safety. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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