Seoul, South Korea

Bum Yong Lee

This inventor holds 1 USPTO granted patent and 3 published patent applications, plus 1 CIPO patent and 1 EPO patent. Top assignee: Ztacom Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bum Yong Lee. Retrieved from https://idiyas.com/inventor/bum-yong-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0


 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bum Yong Lee and Smart Ring Manufacturing Innovation.

Introduction

Bum Yong Lee is an inventor based in Seoul, South Korea. His patent work focuses on a manufacturing method for a smart ring designed to accommodate sensing and communication components.

Latest Patents

Lee’s listed patent is “Method of Manufacturing Smart Ring, and Smart Ring Manufactured Through the Method.” It describes a process for making a ring-shaped outer cover, producing a sensor and communication module, and assembling the module inside the cover. The method then forms an inner molded unit with a finger opening and creates a sensing window that allows signals or light to reach the sensor. The disclosed approach forms the inner unit by filling the assembly’s interior with molding material and cutting a shaped opening through its center. Lee has 1 patent listed in the provided information.

Career Highlights

The supplied career information associates Lee with Ztacom Co., Ltd. and Hong-In Chemical Co., Ltd. His patent reflects work on integrating biological-signal sensing technology into a wearable ring and describes manufacturing steps for assembling its components.

Collaborations

Lee’s listed coworkers include Sang Il Lee and Ji Ha Hwang. The provided information does not specify their roles in the patent or their relationship to the invention.

Conclusion

Bum Yong Lee’s listed invention presents a manufacturing approach for a smart ring that combines a sensor and communication module with a molded inner structure and sensing window.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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