This inventor holds 1 USPTO granted patent. Top assignees: Guardnec Co., Ltd., Samsung Electronics Co., Ltd.. Active years: 2019.
Company Filing History:
1 out of 5 
1 out of 132,107 
Years Active: 2019
Title: The Innovations of Bugon Kim
Introduction
Bugon Kim is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of adhesive technology. His innovative work has led to the development of a unique thermo-reversible adhesive composition.
Latest Patents
Bugon Kim holds 1 patent for his invention titled "Thermo-reversible adhesive composition and thermo-reversible adhesive sheet comprising the same." This patent describes a thermo-reversible adhesive composition that includes a base resin, methyl acetoacetate, and a metal-organic complex compound. The formula for the metal-organic complex compound is M(X)(R), where M represents a metal selected from aluminum, iron, and nickel. The components X and R, along with the integers n and o, are defined to ensure the proper functionality of the adhesive.
Career Highlights
Throughout his career, Bugon Kim has worked with prominent companies such as Samsung Electronics Co., Ltd. and Guardnec Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Bugon Kim has collaborated with talented individuals in his field, including coworkers Yongbeom Kim and Kiho Park. These collaborations have likely enhanced his work and led to further advancements in adhesive technology.
Conclusion
Bugon Kim's contributions to adhesive technology through his innovative patent demonstrate his expertise and commitment to the field. His work continues to influence the industry and inspire future innovations.