Company Filing History:
Years Active: 2010-2014
Title: Budi Njoman: Innovator in Integrated Circuit Packaging
Introduction
Budi Njoman is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit packaging. With a total of 2 patents, he has made significant advancements that enhance the performance and reliability of electronic devices.
Latest Patents
Njoman's latest patents include innovative designs for integrated circuit packages. One of his patents focuses on an integrated circuit package that features a heat spreader device coupled to the bottom portion of the package below the IC die. This design minimizes the risk of molding compound bleeding onto the heat spreader, which can lead to delamination issues. His second patent introduces a high thermal performance packaging method for circuit dies, which involves creating a recessed region in the encapsulating material to improve heat dissipation.
Career Highlights
Throughout his career, Budi Njoman has worked with prominent companies such as Agere Systems Inc. and LSI Corporation. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the electronics industry.
Collaborations
Njoman has collaborated with talented individuals in his field, including Kok Hua Chua and Zheng Peng Xiong. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Budi Njoman's work in integrated circuit packaging showcases his commitment to innovation and excellence. His patents reflect a deep understanding of thermal management in electronic devices, making him a valuable contributor to the industry.