logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8859333 B1

PDFFull Text
Expired
Date of Patent:
Oct. 14, 2014

Filed:

Dec. 12, 2006

Integrated circuit package and a method for dissipating heat in an integrated circuit package

Applicants:

Kok Hua Simon Chua, Singapore, SG;

Budi Njoman, Singapore, SG;

Inventors:

Kok Hua Simon Chua, Singapore, SG;

Budi Njoman, Singapore, SG;

Assignee:

LSI Corporation, Milpitas, CA (US);

Attorneys:

Daniel J. Santos

Smith Risley Tempel Santos LLC

Primary Examiner:

Benjamin Sandvik

Assistant Examiner:

Leslie Pilar Cruz

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/16 (2006.01); H01L 23/367 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/01082 (2013.01); H01L 23/13 (2013.01); H01L 2224/83385 (2013.01); H01L 23/3128 (2013.01); H01L 23/4334 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01023 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 21/565 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/01033 (2013.01); H01L 24/32 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An IC package that is suitable for surface mounting arrangements includes a heat spreader device that is coupled to a bottom portion of the package below the IC die. Coupling the heat spreader device to the bottom portion of the package reduces or eliminates the possibility that placement of the heat spreader device will result in the molding compound bleeding on top of the heat spreader device, and delamination at the footings of the heat spreader device that can cause the package to delaminate, or 'popcorn'.

Find Patent Forward Citations

Chua, Kok Hua Simon. (2014). Integrated circuit package and a method for dissipating heat in an integrated circuit package (U.S. Patent No. 8859333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8859333

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…