Company Filing History:
Years Active: 2017
Title: Bryan Lieb - Innovator in Copper Electroplating
Introduction
Bryan Lieb is a notable inventor based in Carlisle, MA (US). He has made significant contributions to the field of electroplating, particularly with his innovative methods that enhance the quality of copper deposits.
Latest Patents
Bryan Lieb holds 1 patent for a plating method that involves copper electroplating baths. His patent specifies that baths with a surface tension of ≤40 mN/m are suitable for filling vias with copper, resulting in deposits that are substantially void-free and free of surface defects.
Career Highlights
Bryan Lieb is currently employed at Rohm & Haas Electronic Materials LLC, where he applies his expertise in electroplating technologies. His work has been instrumental in advancing the capabilities of electronic materials.
Collaborations
Throughout his career, Bryan has collaborated with talented individuals such as Matthew A. Thorseth and Mark Scalisi, contributing to various projects and innovations in the field.
Conclusion
Bryan Lieb's contributions to copper electroplating demonstrate his commitment to innovation and excellence in electronic materials. His work continues to influence the industry positively.