Enniscorthy, Ireland

Bryan D Leech

This inventor holds 1 USPTO granted patent. Top assignee: Olgesby & Butler Plc. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bryan D Leech. Retrieved from https://idiyas.com/inventor/bryan-d-leech

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Innovations of Bryan D Leech

Introduction

Bryan D Leech is an accomplished inventor based in Enniscorthy, Ireland. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. His work reflects a commitment to enhancing everyday tools and improving their functionality.

Latest Patents

One of Bryan's notable patents is a soldering iron with a removable cap. This invention showcases his ability to combine practicality with user-friendly design, making soldering tasks more efficient and safer for users.

Career Highlights

Bryan is currently employed at Oglesby & Butler Plc, where he continues to develop and refine his inventions. His role at the company allows him to collaborate with other talented professionals in the field, further enhancing his skills and contributions to innovation.

Collaborations

Throughout his career, Bryan has worked alongside notable colleagues such as John V McNulty and Alfred P Oglesby. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking inventions.

Conclusion

Bryan D Leech exemplifies the spirit of innovation through his work and patents. His contributions to the field of technology, particularly with his soldering iron invention, highlight his dedication to improving tools for everyday use.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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