This inventor holds 2 USPTO granted patents. Top assignees: Epcos Ag, Siemens Matsushita Components Gmbh & Co Kg. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Bruno Fürbacher: Innovator in Electronic Component Encapsulation
Introduction
Bruno Fürbacher is a notable inventor based in Ingolstadt, Germany. He has made significant contributions to the field of electronic components, particularly in the area of encapsulation technologies. With a total of 2 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
Fürbacher's latest patents include a "Planar resist structure, in particular an encapsulation for electronic component" and a "Method for producing an encapsulation for a SAW component operating with surface acoustic waves." The first patent describes a thermomechanical process for planarizing a resist layer applied to a partly elevated carrier area. This process results in a resist structure that serves as an encapsulation for electronic components. A dry resist sheet, composed of a temperature-resistant protective sheet and a photosensitive layer, is applied to the carrier's surface. The sheet is then planarized under pressure and heat, followed by exposure and development of the photosensitive layer. The second patent focuses on an encapsulation for SAW components, utilizing a cap to seal component structures on a substrate, ensuring effective protection and functionality.
Career Highlights
Throughout his career, Bruno Fürbacher has worked with prominent companies such as Siemens Matsushita Components GmbH & Co. KG and EPCOS AG. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the electronics sector.
Collaborations
Fürbacher has collaborated with notable colleagues, including Friedrich Lupp and Wolfgang Pahl. These partnerships have fostered a creative environment that has led to advancements in their respective fields.
Conclusion
Bruno Fürbacher's contributions to electronic component encapsulation demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to enhancing the functionality and reliability of electronic devices. His work continues to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile