Company Filing History:
Years Active: 1998-2011
Title: Innovations by Bruce Reid in Semiconductor Technology
Introduction
Bruce Reid is an accomplished inventor residing in Mesa, AZ. With a focus on semiconductor technology, he holds two patents that reflect his innovative contributions to the industry.
Latest Patents
Bruce Reid's most recent patents include advancements in semiconductor packaging methods. His first patent describes a semiconductor package substrate that features an array of identical package sites. This design is fully covered by an encapsulant, ensuring protection and durability. The individual package sites can be singulated by sawing through both the encapsulant and the substrate. His second patent reiterates a similar innovative structure, further refining the semiconductor package substrate and its encapsulation process.
Career Highlights
Throughout his career, Bruce has made significant strides in the semiconductor field, working with prominent companies such as Motorola Corporation and Freescale Semiconductor. His experience at these organizations has undoubtedly influenced his inventive process, allowing him to translate complex engineering challenges into actionable patent designs.
Collaborations
During his journey as an inventor, Bruce Reid has had the pleasure of collaborating with talented professionals in the industry, including Son Ky Quan and Samuel L. Coffman. These partnerships have likely played a vital role in the development and successful implementation of his innovative ideas.
Conclusion
Bruce Reid’s contributions to semiconductor packaging technology exemplify the spirit of innovation that drives the industry forward. His patents not only showcase his expertise as an inventor but also highlight the importance of collaboration and continuous improvement in technological advancements. Through his work, Reed continues to influence the future of semiconductor design and application.