Motorola Corporation

Freescale Semiconductor,inc.

Bruce Reid

Keith E Nelson

Samuel L Coffman

Deborah A Hagen

Son Ky Quan

A semiconductor package substrate () has an array of package sites (, and) that are substantially identical. The entire array of package sites (, and) is covered by an encapsulant (). The individual package sites (, and) are singulated by sawing through the encapsulant () and the underlying semiconductor package substrate ().

Semiconductor package and method therefor

A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).

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Mesa, AZ, United States of America

Bruce Reid