Gourock, United Kingdom

Briand L Robertson

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Briand L Robertson. Retrieved from https://idiyas.com/inventor/briand-l-robertson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 70(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: Briand L Robertson: Innovator in Solder Particle Deposition

Introduction

Briand L Robertson is a notable inventor based in Gourock, GB. He has made significant contributions to the field of solder particle deposition, showcasing his expertise through his innovative patent. His work is particularly relevant in the context of direct chip attach technology, which is crucial for modern electronic devices.

Latest Patents

Robertson holds a patent for a method of solder particle deposition. This patent involves the deposition of solder particles onto metallized contacts of a direct chip attach (DCA) site located on a substrate. The process includes coating the contacts with a layer of flux and utilizing a pick-up head positioned in a reservoir of solder particles. The particles are attracted to apertures in the head, which correspond to the footprint of the metallized contacts. Once positioned adjacent to the substrate, the particles are released and adhere to the flux-coated contacts. The particles are then reflowed, leveled, and coated again with flux before an integrated circuit chip is placed and reflowed to attach it to the contacts. This innovative approach enhances the efficiency and reliability of electronic component assembly.

Career Highlights

Briand L Robertson is associated with the International Business Machines Corporation (IBM), where he has contributed to advancements in technology and innovation. His work in solder particle deposition is a testament to his skills and dedication to improving electronic manufacturing processes.

Collaborations

Robertson has collaborated with notable coworkers, including Alexander Boyd and Kenneth Skene Murray. Their combined expertise has likely contributed to the success of their projects and innovations within the company.

Conclusion

Briand L Robertson's contributions to solder particle deposition reflect his innovative spirit and commitment to advancing technology. His patent and work at IBM highlight the importance of collaboration and ingenuity in the field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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