Company Filing History:
Years Active: 2025
Title: Innovations by Brian Veraa
Introduction
Brian Veraa is an accomplished inventor based in Round Rock, Texas. He has made significant contributions to the field of circuit design through his innovative patent. His work focuses on enhancing the efficiency and accuracy of hierarchical design rule checking (DRC) analysis.
Latest Patents
Brian Veraa holds a patent for "Effective metal density screens for hierarchical design rule checking (DRC) analysis." This invention includes systems and methods designed to provide hierarchical circuit designs that utilize effective metal density screens during DRC analysis. A notable aspect of his patent involves a computer-implemented method that provides a first hierarchical level of a chip design, which includes internal shapes and blockage shapes defined at a second hierarchical level. The method assigns a tuple to the blockage shape, which includes a metal layer identifier, a minimum expected density, and a maximum expected density. This innovative approach allows for the determination of density violations in the hierarchical design.
Career Highlights
Brian is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to work on cutting-edge technologies and contribute to advancements in circuit design.
Collaborations
Some of Brian's coworkers include Ryan Michael Kruse and Christopher J Gonzalez. Their collaboration fosters a creative environment that enhances innovation and problem-solving within their projects.
Conclusion
Brian Veraa's contributions to the field of circuit design through his patent demonstrate his commitment to innovation and excellence. His work at IBM and collaborations with talented colleagues further highlight his impact on the industry.