Bloomington, IN, United States of America

Brian Tankersley

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Cook Medical Technologies LLC. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Tankersley. Retrieved from https://idiyas.com/inventor/brian-tankersley

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Brian Tankersley: Innovator in Medical Device Technology

Introduction

Brian Tankersley is a notable inventor based in Bloomington, IN (US). He has made significant contributions to the field of medical device technology, particularly through his innovative patent.

Latest Patents

Tankersley holds a patent for "Hydrophobically encased tungsten." This invention discloses compositions of matter intended for inclusion in medical devices aimed at visualization purposes. The compositions may include a radiopaque metal, such as tungsten, within a functionalized hydrophobic polymer. Additionally, the patent outlines methods for creating devices that incorporate these elements.

Career Highlights

Brian Tankersley is associated with Cook Medical Technologies LLC, where he applies his expertise in developing advanced medical solutions. His work focuses on enhancing the functionality and effectiveness of medical devices.

Collaborations

One of his notable coworkers is David A Drewes, with whom he collaborates on various projects within the company.

Conclusion

Brian Tankersley's innovative work in medical device technology, particularly his patent on hydrophobically encased tungsten, showcases his commitment to advancing healthcare solutions. His contributions are vital in improving visualization techniques in medical applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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