Scottsdale, AZ, United States of America

Brian T Beckwith

This inventor holds 1 USPTO granted patent. Top assignee: Zephyros, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian T Beckwith. Retrieved from https://idiyas.com/inventor/brian-t-beckwith-91cobnkr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Brian T Beckwith: Innovator in Composite Pipe Technology

Introduction

Brian T Beckwith is a notable inventor based in Scottsdale, AZ (US). He has made significant contributions to the field of composite materials, particularly in the development of innovative solutions for pipe repair and installation.

Latest Patents

Beckwith holds 1 patent for his invention titled "Composite sleeve for forming a cure in place pipe, composite pipes, and materials and methods thereof." This invention relates to composite sleeves designed for producing a cured in place pipe. It encompasses materials and methods for creating the composite sleeve, as well as techniques for repairing a native pipe using this sleeve. The composite sleeve features multiple layers, including a core layer made of a curable one-part resin composition. This resin composition remains solid at 25° C but is pliable enough to be flexed during manufacturing and installation.

Career Highlights

Brian T Beckwith is currently employed at Zephyros, Inc., where he continues to innovate in the field of composite materials. His work focuses on enhancing the efficiency and effectiveness of pipe repair technologies.

Collaborations

One of his notable coworkers is Kenneth Biscorner, with whom he collaborates on various projects within the company.

Conclusion

Brian T Beckwith's contributions to composite pipe technology demonstrate his commitment to innovation and problem-solving in the field. His patent reflects a significant advancement in materials science, particularly for applications in pipe repair and installation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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