Bellevue, WA, United States of America

Brian Scott Lau

This inventor holds 2 USPTO granted patents. Top assignees: Sesame Ai, Inc., Other. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Scott Lau. Retrieved from https://idiyas.com/inventor/brian-scott-lau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0


Company Filing History:

goldMedal2 out of 10 
 
Sesame Ai, Inc.
 patents
silverMedal1 out of 834,708 
Other
 patents
where one patent can have more than one assignee

Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Brian Scott Lau: Wearable Electronics and Flexible Circuit Innovations

Introduction

Brian Scott Lau is an inventor based in Bellevue, Washington. His work includes inventions related to flexible printed circuit boards and inductive charging for wearable devices. He is associated with Sesame AI, Inc., and has 2 patents.

Latest Patents

Lau’s patent, “Single Axis Conductive Flexible Printed Circuit Board Stiffener,” describes a stiffener made from nonconductive material containing conductive elements that run vertically through its body. The design provides electrical connections between components on opposite sides while limiting current flow to paths along those conductive elements.

His patent, “Integrated Inductive Charging for Wearable Devices,” describes a wearable device with conductive exterior and interior bands. Together, the bands form a single-turn coil that can serve as a receiving coil for inductive charging.

Career Highlights

Lau’s disclosed inventions address practical design challenges in electronics: creating controlled conductive paths through flexible circuit-board structures and integrating wireless charging into wearable devices. His work is associated with Sesame AI, Inc.

Collaborations

Matthew Devoe is identified as Lau’s coworker.

Conclusion

Brian Scott Lau’s patent work focuses on flexible circuit-board connections and inductive charging, with applications in electronic and wearable-device design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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