Seattle, WA, United States of America

Brian Scott Kasperson

This inventor holds 4 USPTO granted patents, plus 1 CIPO patent and 1 EPO patent. Top assignee: The Boeing Company. Active years: 2014-2026.


% Patents Active = 100.0


 

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2014-2026

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4 patents (USPTO):Explore Patents

Title: Brian S Kasperson: Innovator in Fillet Bond Testing

Introduction

Brian S Kasperson is an accomplished inventor based in the United States. He has made significant contributions to the field of testing apparatuses, particularly in the characterization of fillet bonds. His innovative approach has the potential to enhance the reliability and performance of bonded structures.

Latest Patents

Brian S Kasperson holds a patent for a "System And Method For Testing A Fillet Bond." This testing apparatus is designed to characterize the tension strength of a fillet bond in a test specimen. The apparatus includes a lower fixture that maintains the stiffener component in a fixed position and an upper fixture that engages the skin component at discrete locations. This design allows for the isolation of the fillet bond from asymmetric bending during tension tests.

Career Highlights

Brian is currently employed at The Boeing Company, where he applies his expertise in testing and materials. His work focuses on improving the quality and performance of aerospace components through innovative testing methods. Despite having no patents to his name, his contributions to the field are noteworthy.

Collaborations

Brian has collaborated with notable colleagues such as Paul S Gregg and Jack J Esposito. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Brian S Kasperson is a dedicated inventor whose work in testing apparatuses has the potential to impact the aerospace industry significantly. His innovative methods for testing fillet bonds demonstrate his commitment to advancing technology and improving product reliability.

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