Dallas, TX, United States of America

Brian S Spate

This inventor holds 3 USPTO granted patents. Top assignee: Dsc Telecom L.p.. Active years: 1998-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian S Spate. Retrieved from https://idiyas.com/inventor/brian-s-spate

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 38(Granted Patents)


Company Filing History:


Years Active: 1998-1999

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3 patents (USPTO):Explore Patents

Title: Brian S. Spate - Innovator in Electronic Components

Introduction

Brian S. Spate is an accomplished inventor based in Dallas, TX, who has made significant contributions to the field of electronic components. With a total of three patents to his name, Spate has demonstrated his innovative spirit and technical expertise through his work.

Latest Patents

Among his noteworthy inventions, Brian Spate's latest patent is focused on enclosures for electronic components. This innovative design addresses critical needs in the electronics industry, enhancing the durability and efficiency of electronic devices.

Career Highlights

Brian is currently employed at DSC Telecom L.P., where he continues to develop and refine technologies that advance telecommunications. His work has played a vital role in improving communication infrastructures.

Collaborations

Throughout his career, Spate has collaborated with fellow innovators such as Paul A. Tucker and Gary Nightingale. These partnerships have fostered creativity and led to the development of groundbreaking solutions in the tech industry.

Conclusion

In summary, Brian S. Spate is a key figure in the realm of electronic component innovation. His patents and collaborations highlight his commitment to advancements in technology, making him a valuable asset in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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